AMD specific news
AMD Enables 4G/5G Radio access network solutions to support Meta Connectivity Evenstar programedit
Ever star RUs with Xilinx Zynq PFSoC architecture provide the flexibility to meet a wide range of requirements including 4G/5G mm Wave and sub-6GHz using the same foundational hardware.
Publication: SME Channels
AMD powers the world’s fastest Supercomputer with Exaflop Performanceedit
Now, officially in 2022, AMD EPYC processors and AMD Instinct accelerators are now powering the first supercomputer to ever break the exascale barrier. So, the Oak Ridge National Laboratory’s Frontier system ranked No. 1 on both the Top500 and Green500, coming with 1.102 exaflops of performance and 62.68 gigaflops/watt power efficiency.
Publication: Techno Sports
Frontier supercomputer powered by AMD is the fastest in the worldedit
The AMD-powered Frontier supercomputer at Oak Ridge National Laboratory has bagged the top spot on the Top500 list of the world’s fastest supercomputers. The Top500 list also said that the Frontier system is the first true exascale machine with an HPL score of 1.102 Exaflop/s. For two years, the top spot was occupied by the Fugaku system at the RIKEN Center for Computational Science (R-CCS) in Kobe, Japan.
Publication: Analytics India Mag
AMD brand mentions
Ibase Expandable Embedded System with AMD Ryzen Embeddededit
Taipei, Taiwan IBASE Technology unveils its CMI211989 embedded system powered by AMD Ryzen Embedded V2000 processors based on the innovative Zen 2 x86 core architecture using advanced 7nm manufacturing process.
Publication: Times Tech
Atos boosts weather forecasting capacity with BullSequana supercomputeredit
“Weather prediction requires a huge amount of computing power and with our BullSequana XH2000, equipped with the latest generation AMD’s EPYC 7003processors and NVIDIA HDR InfiniBand, FMI will be able to increase its computing capacity to deliver significant improvements in numerical weather predictions”, said Emmanuel Le Roux, Group SVP, Global Head of HPC, AI & Quantum at Atos.
Publication: Communications Today
Apple MacBook Air 2022 could use M1 chip AGAIN but with a new nameedit
Will the M2 chip being a mildly updated M1 chip pose an issue for prospective buyers looking for an upgrade The current M1 chip is based on the 5nm process and is among the most efficient chips around for a PC. Despite the 12th Gen Intel processors and AMD Ryzen 6000 series processors around, the M1 chip continues to lead the game in terms of efficiency and battery life.
Publication : Tech Hindustan Times
Minisforum Unveils UM560 Venus Series Mini PC: Powered By AMD Barcelo, Ryzen 5 5625U APU & Starting at €349edit
MINISFORUM today announced their UM560 mini PC, which is listed in their new mini PC series, the Venus series, to provide ultimate performance and work flexibility with AMD Ryzen 5 5625U processor and Radeon Graphics. UM560 is the first AMD mini PC with Alt-Mode USB-C and the world’s first mini PC that comes with a GaN power supply.
Publication: wccftech
Competition in news
Atos boosts weather forecasting capacity with BullSequana supercomputeredit
“Weather prediction requires a huge amount of computing power and with our BullSequana XH2000, equipped with the latest generation AMD’s EPYC 7003processors and NVIDIA HDR InfiniBand, FMI will be able to increase its computing capacity to deliver significant improvements in numerical weather predictions”, said Emmanuel Le Roux, Group SVP, Global Head of HPC, AI & Quantum at Atos.
Publication: Communications Today
Intel And TSMC Facing Other Issues Due To Global Chip Shortageedit
Chips for chipmaking machines are one of the things in short supply amid chip shortage constraints, say executives from Intel and Apple chipmaker TSMC. According to 9To5Mac, buying new chipmaking machines was never a speedy process, given their complexity and delicacy, but lead times before the pandemic were measured in months.
Publication : News 18
Intel and Samsung CEO meets hinting at a possible Future Collaborationedit
According to the Korea Herald, Intel CEO Pat Gelsinger visited Seoul to meet with several top Samsung executives. The talks, which were confirmed by Samsung, have spurred speculation about possibly new Intel-Samsung collaboration plans. Gelsinger flew to South Korea to meet with Samsung executives after attending the 2022 World Economic Forum in Davos, Switzerland. Samsung Electronics Vice Chairman Lee Jae-Yong, co-CEO and chip business boss Kyung Kye-Hyun, head of Samsung Mobile Roh Tae-moon, and other senior Samsung executives sat around the table.
Publication: Techno Sports
Chips for chipmaking machines affected, says TSMC, Inteledit
Ganesh Moorthy, CEO of Microchip Technology Inc., a maker of microcontroller chips that process data in all kinds of electronic devices, including chip-making equipment, said his company now is treating chip-equipment suppliers as priority customers, not unlike the way it treated medical-device manufacturers at the onset of the Covid pandemic. Intel and Apple chipmaker TSMC are among those calling for this approach to be more widely adopted.
Publication: Economic Times
Intel teases next-gen GPUs built to power record-breaking new supercomputersedit
Intel has teased a new line of server GPUs built to power the next generation of record-breaking supercomputers, codenamed Rialto Bridge. An evolution of the existing Ponte Vecchio design, the new cards will feature as many as 160 Xe GPU cores and “offer significantly increased density, performance and efficiency”, the company says.
Publication: Tech Radar
Partner in news
Apple MacBook Air 2022 could use M1 chip AGAIN but with a new nameedit
Will the M2 chip being a mildly updated M1 chip pose an issue for prospective buyers looking for an upgrade The current M1 chip is based on the 5nm process and is among the most efficient chips around for a PC. Despite the 12th Gen Intel processors and AMD Ryzen 6000 series processors around, the M1 chip continues to lead the game in terms of efficiency and battery life.
Publication : Tech Hindustan Times
Intel and Samsung CEO meets hinting at a possible Future Collaborationedit
According to the Korea Herald, Intel CEO Pat Gelsinger visited Seoul to meet with several top Samsung executives. The talks, which were confirmed by Samsung, have spurred speculation about possibly new Intel-Samsung collaboration plans. Gelsinger flew to South Korea to meet with Samsung executives after attending the 2022 World Economic Forum in Davos, Switzerland. Samsung Electronics Vice Chairman Lee Jae-Yong, co-CEO and chip business boss Kyung Kye-Hyun, head of Samsung Mobile Roh Tae-moon, and other senior Samsung executives sat around the table.
Publication: Techno Sports
Industry news
India PC market: India PC market shipments skyrocket 48% to 5.8 mln units in Q1: Canalysedit
1 million shipments, while Acer overtook Dell with a 256 2% growth to 626,000 shipments, according to Canalys Dell and Samsung closed off the chart at fourth and fifth positions, respectively, with a 10% and 7 4% share of the overall market HP also led desktop and notebook shipments with a 34% share of the market, followed by Lenovo.
Publication: ET Telecom
India’s PC shipments at record 5.8 million units in Q1: Canalysedit
In terms of top vendors across segments, HP took the first spot with a 24.9 per cent market share, followed by Lenovo with a 19.3 per cent share with 1.1 million shipments. Acer took the third spot with a 10.7 per cent market share, followed by Dell at 10 per cent and Samsung at 7.4 per cent.
Publication: The Hindu Business Line
US retakes top spot in supercomputer raceedit
Frontier gives that top position back to the lab. The system, built by Hewlett Packard Enterprise using two kinds of chips from Advanced Micro Devices, was more than twice as fast as Fugaku in the tests used by the Top500 organization.
Publication: The Financial Express
Chips for chipmaking machines affected, says TSMC, Inteledit
Ganesh Moorthy, CEO of Microchip Technology Inc., a maker of microcontroller chips that process data in all kinds of electronic devices, including chip-making equipment, said his company now is treating chip-equipment suppliers as priority customers, not unlike the way it treated medical-device manufacturers at the onset of the Covid pandemic. Intel and Apple chipmaker TSMC are among those calling for this approach to be more widely adopted.
Publication: Economic Times
Uncategorized
Video games for climate action: winning solutions for the planetedit
From climate and environment themed videogames to special features, popups, and reallife tree planting opportunities embedded within beloved classics like PACMAN or Angry Birds, the gaming industry is working with the United Nations to engage audiences like never before and inspire a new wave of climate action.
Publication : India Blooms
Intel Promises Performance Boosts of Over 3x with Sapphire Rapids-SP HBM Variants in HPC Workloadsedit
Intel has shared further details of its 4th Gen Xeon Scalable processors featuring on-die HBM (select SKUs) for improved HPC performance. Known as Sapphire Rapids HBM, these CPUs will feature up to 64GB of on-chip HBM2e memory to accelerate bandwidth-heavy HPC and AI workloads. The HBM stacks will be placed on the two opposite ends of the substrate, one next to each of the compute tiles (chiplets).
Publication : Hardware Times
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