AMD and Samsung Electronics have signed a memorandum of understanding to expand their collaboration on next-generation AI memory and computing technologies. The signing ceremony was held at Samsung’s most advanced chip manufacturing complex in Pyeongtaek, Korea, attended by Dr. Lisa Su, Chair and CEO of AMD, and Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics.

Publication: CXO Voice

AMD has secured a key strategic partnership aimed at strengthening its presence in advanced computing and manufacturing ecosystems. The collaboration focuses on leveraging combined capabilities to drive innovation, enhance performance across AI and data-driven workloads, and support next-generation technology development, positioning AMD to better compete in the evolving semiconductor and enterprise solutions landscape.

Publication: Manufacturing Today

AMD has announced a strategic collaboration with NAVER Cloud to accelerate the development of sovereign AI infrastructure in Korea, supporting national scale AI capabilities with AMD’s open, high performance compute platforms.

Publication: Var India

Agentic AI is shifting focus back to CPUs in AI data centers as these systems handle orchestration, decision-making, and task coordination—functions that GPUs alone cannot efficiently manage. Unlike traditional AI workloads, agentic AI involves complex, multi-step processes requiring strong CPU involvement for control and latency management. As a result, CPUs are becoming critical for performance, energy efficiency, and scaling, driving a more balanced CPU-GPU architecture in modern AI infrastructure.

Publication: CXO Today

AMD and Tata Consultancy Services plan accelerate India s data centre and enterprise AI transformation. AMD Technology and Tata Consultancy Services (TCS) have announced the expansion of their collaboration.

Publication: Electronics For You

AMD has published a guide for running OpenClaw locally on Windows through two distinct hardware paths it calls “RyzenClaw” and “RadeonClaw,” both built around its own silicon and designed to keep AI agent workloads off the cloud entirely.

Publication: Tech Power Up

The effort is part of AMD’s broader Agent Computer initiative, which argues that the future of AI isn’t limited to remote infrastructure. Instead, it envisions a world where users control both their data and their computing environment – where AI assistants operate continuously with reduced network dependence, fewer external subscriptions, and fewer privacy concerns.

Publication: Techspot

Nvidia, AMD, Broadcom joined hands with Microsoft and OpenAI to form the Optical Compute Interconnect (OCI) MultiSource Agreement (MSA) consortium that aims to provide a pivotal shift towards a hyperscaler driven open ecosystem to enable the development of a multivendor supply chain for optical scaleup interconnects.

Publication: CXO Today

How come Sony can do it and AMD can’t? Let’s clarify something that apparently is not widely recognized as an issue. Microsoft designed the D3D12 Cooperative Vector function to work on as many GPUs as possible.

Publication: Tech Powerup

Lisa Su is expected to visit South Korea on March 18 to meet Jay Y. Lee to discuss securing supplies of high-bandwidth memory (HBM) chips used in AI processors. The visit also includes talks with Naver on potential cooperation in data-center semiconductors and sovereign AI infrastructure, amid surging global demand for AI memory chips.

Publication: The Economic Times