AMD specific news
AMD appoints Vinay Awasthi as SVP Sales for APJ Regionedit
AMD has appointed Vinay Awasthi as Senior Vice President of Sales for the Asia Pacific and Japan (APJ) region. Based in Singapore, he will spearhead the regional sales strategy, focusing on enhancing customer engagement, strengthening OEM and channel partnerships, and aligning go-to-market strategies across the diverse APJ markets to foster growth in cloud, enterprise, AI, commercial, and consumer sectors.Publication: Manufacturing Today
AMD CEO Lisa Su shares the advice from an IBM executive that convinced her to join a struggling company: ‘I was …’edit
AMD CEO Lisa Su revealed the piece of career advice she received as a young engineer at IBM that went on to shape her leadership style and career decisions. Speaking about her early years in the technology industry (via Benzinga), Su said an IBM executive encouraged her to stop avoiding difficult challenges and instead focus on solving the toughest problems.
Publication: The Times of India
AMD brand mentions
When bits and bytes take a large biteedit
There are numerous players in the chips space. But in this story, we look at what’s happening through the eyes of eight large, entrenched players namely — Nvidia, Micron, Broadcom and AMD (the US); Samsung Electronics and SK hynix (South Korea); Taiwan’s TSMC and ASML from Netherlands. Refer Table 3 for their businesses.
Publication: The Hindu Business Line
Competition in news
AI infrastructure boom puts Nvidia and Taiwan at the heart of Computex 2026edit
Other global chip executives attending the show, set to be the biggest Computex ever with 1,500 exhibitors, include Intel CEO Lip-Bu Tan, Qualcomm Chief Executive Cristiano Amon and Arm boss Rene Haas. Marvell’s chief executive, Matt Murphy, and NXP Semiconductors CEO Rafael Sotomayor will also be there.
Publication: The Indian Express
Computex 2026: Snapdragon C chipset, AI laptops and other announcements ahead of the showedit
Companies including Acer, AMD, Intel, Qualcomm, and MediaTek have announced new products and platforms ahead of the event, giving us an early look at where the PC industry is headed in 2026. Interestingly, many of these announcements focus on local AI processing, meaning devices can run advanced AI features directly on the machine without relying heavily on the cloud.
Publication: Digit
Nvidia sends ‘warning’ message to Intel, AMD and Qualcomm, hints Microsoft is on-board in ‘a new era of… ‘edit
The teaser essentially serves as a warning shot to traditional PC chip champions like Intel and AMD, as well as chip giant Qualcomm. The big reveal is expected to take place at two major tech events: Microsoft’s Build developer conference in San Francisco and the Computex trade show in Taiwan.
Publication: The Times of India
Qualcomm introduces Snapdragon C platformedit
The chip is designed to prioritise battery life, efficiency, and everyday computing tasks. Devices from Acer, HP, and Lenovo powered by the Snapdragon C platform are expected later this year.
Publication: Business Standard
Nvidia PC chipsedit
Nvidia and Microsoft are expected next week to debut the rst Windows OS computers that use Nvidia‘s chips as the main processor, Axios reported on Saturday, citing sources. Nvidia-powered computers are expected from lVlicrosoft’s Surface brand, as well as other computer makers.
Publication: The Telegraph
Industry news
India and US push deeper AI and chip ties as firms eye access to nextgeneration technologiesedit
Semiconductors and artificial intelligence have now taken primacy among a larger set of critical and emerging technologies, which had been zeroed in by both governments a few years back. This was further emphasised in latest talks held under the overall bilateral framework of the TRUST Initiative, an official said.
Publication: The Economic Times
Semiconductor plant in Assam likely to start production this fiscal, Union Minister Ashwini Vaishnaw saysedit
The semiconductor plant at Jagiroad in Assam is expected to start production within this financial year, I&B and Electronics and IT Minister Ashwini Vaishnaw has said. Vaishnaw said this after his meeting with Assam Chief Minister Himanta Biswa Sarma on Saturday evening.
Publication: The Economic Times
Need to build a 150 billion semiconductor value chain by 2035edit
India needs to step-up its game in the semiconductor space, if it intends to be a global player in the sector. By 2035, India should target building a 120 billion-150 billion semiconductor value chain, by choosing leadership and purpose over participation, according to a report released by NITI Aayog.
Publication: Hindi Business Standard
India to create 150 billion semiconductor value chain: NITI Aayogedit
The country should aim to play a leadership role in the global semiconductor sector by 2035 rather than being a mere participant and develop a 120-150 billion semiconductor value chain. This was stated in a report released by NITI Aayog on Friday.
Publication: Sanmarg
India’s semiconductor push a strategic imperativeedit
India must accelerate efforts to build a domestic semicon-ductor ecosystem, with self-reliance in chips emerging as central to economic resil-ience, national security and societal upliftment, accord-ing to a new report by NITI Aayog. P.
Pubication: The Sunday Guardian
Intel, Odisha sign semicon substrate production dealedit
Union Minister of Electronics and IT Ashwini Vaishnaw, along with Chief Minister of Odisha Mohan Charan Majhi, Intel CEO Lip-Bu Tan, and other dignitaries, witnessed the signing of the MoU, the statement said. “Congratulations to Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India. This will further advance the semiconductor ecosystem in India,” Vaishnaw said.
Publication: The Hindu Business Line
Intel, 3DGS to set up 3.3 bn glass substrate unit in Odishaedit
Chip major Intel on Friday signed a pact with 3D Glass Solutions (3DGS) and the Odisha government to set up a 3.3 billion advanced packaging glass-core substrate manufacturing facility in the Bhubaneswar-Khurda region, officials said.
Publication: Business Standard
Intel, 3DGS to set up 3.3 billion glass substrate unit in Odishaedit
Chip major Intel on Friday signed a pact with 3D Glass Solutions (3DGS) and the Odisha government to set up a 3.3 billion advanced packaging glass-core substrate manufacturing facility in the Bhubaneswar-Khurda region, officials said.
Publication: Hindi Business Standard
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