July 24, 2026

AMD specific news

AMD and Kimi Deliver 3.2× Lower Latency for Codingedit

AMD and Moonshot AI have optimized Kimi’s coding model for AMD GPUs, delivering up to 3.2× lower tail latency and 7.7% higher token throughput through software-level inference improvements. The collaboration enhances coding performance on AMD AI infrastructure while improving responsiveness and efficiency for enterprise AI workloads.

Publication: AIM

AMD, Cerebras Enter Partnership to Combine Helios and Wafer Scale Engineedit

AMD and Cerebras have partnered to combine AMD’s Helios rack-scale AI infrastructure with Cerebras’ Wafer Scale Engine to deliver a disaggregated AI inference platform. The collaboration is designed to improve inference performance and efficiency by separating prompt processing and token generation across specialized compute architectures.

Publication: AIM

AMD vs Nvidia? Lisa Su bets on a ‘different path’ to lead AI compute at scaleedit

Lisa Su at Advancing AI 2026 positioned AMD on a distinct chiplet/portfolio architecture path for scalable AI compute. Su emphasized leadership in large-scale inference and training via Helios, MI400 GPUs, and open ecosystem, projected AMD outgrowing entire semiconductor market today market, with $2T AI TAM by 2030. Su highlighted ROCm.ai for agentic coding and momentum among multiple hyperscalers.

Publication: Moneycontrol

AMD, Cerebras Enter Partnership to Combine Helios and Wafer Scale Engineedit

AMD and Cerebras also announced a partnership to deliver a disaggregated AI inference system combining AMD s Helios rack scale infrastructure with Cerebras Wafer Scale Engine.

Publication: Analytics India Mag

AMD unveils first racks cale AI system Helios, expands hardware portfolio to target agentic AI boomedit

Advanced Micro Devices (AMD) has finally unveiled its first rack scale AI system, AMD Helios, alongside a new lineup of AI chips, processors and robotics products on July 23 at its Advancing AI 2026 event in San Francisco. These announcements are significant as the chipmaker seeks to strengthen its position against rival Nvidia in the rapidly growing market for AI infrastructure.

Publication: Money Control

AMD Ryzen 7 7700X3D Review: The gaming upgrade that knows where to save moneyedit

91Mobiles reviewed the AMD Ryzen 7 7700X3D, highlighting its strong gaming performance, competitive pricing, and power efficiency, while positioning it as the most value-oriented processor in AMD’s X3D lineup. Varun Mirchandani concluded that the processor delivers the best price-to-performance balance for gamers, recommending users invest the savings over flagship X3D chips in better GPUs, faster memory, or larger SSDs, while noting it is less suited for content creation.

Publication: 91Mobiles

AMD Expands Roadmap Through 2030, Helios in Full Productionedit

AMD announced the Instinct MI400 GPU family, the Helios rack scale AI platform, the 6th Gen EPYC 9006 processors, at its Advancing AI 2026 event.

Publications: Analytics India Mag

AMD expected to launch next generation of AI infrastructure to challenge Nvidiaedit

This is an anticipatory preview, that positions AMD in direct competition with NVIDIA in the growing data center inference computing market. Deals with Anthropic, Open AI are highlighted.

Publication: Economic Times

Intel, AMD sign server CPU deals with Chinese clientsedit

US chipmaking giants Intel and Advanced Micro Devices (AMD) are signing longer-term purchase commitments with Chinese server customers for data-centre processors as prices surge, two people familiar with the talks said. The move highlights a broader outcome of the AI boom: demand has spread beyond AI accelerators to memory, networking gear, and server processors, giving suppliers more leverage to seek long-term purchase deals.

Publication: MINT

Competition in news

Samsung Unpacked 2026: Qualcomm Expands Galaxy Partnership with Snapdragon AI Platformsedit

Samsung Unpacked, Qualcomm Technologies, Inc. announced that its Snapdragon® 8 Elite Gen 5 Mobile Platform for Galaxy, Snapdragon Wear™ Elite Platform and Snapdragon® AR1 Gen 1 will power Samsung s newest devices – including the Samsung Galaxy Z Fold8 Ultra, Samsung Galaxy Z Fold8, Samsung Galaxy Z Flip8, Samsung Galaxy Watch9, Samsung Galaxy Watch Ultra2[1] and the new Intelligent Eyewear.

Publication: Digital Terminal

Nvidia Debuts Spectrum6 Switches to Power AI Networks of the Futureedit

It connects hundreds of thousands of GPUs with the performance, resilience and efficiency needed for giga scale AI, with AI infrastructure leaders already adopting Nvidia has introduced its next generation SpectrumX Ethernet networking platform that would position the company as a building block for the next wave of giga scale AI factories that can connect millions of GPUs while reducing power consumption and operational costs.

Publication: CXO Today

Partner in news

Databricks and Microsoft extend AI partnership through the 2030s edit

Databricks and Microsoft have expanded their strategic partnership through the 2030s, with both companies strengthening collaboration on enterprise AI, Azure infrastructure and data platform integration.

Publication: Express Computer

Acer India Unveils Acer Run 2026 to Promote Fitness and Inclusionedit

Organized as part of Acer Day 2026, the event commemorates 50 years of Acer globally and 27 years of Acer in India, celebrating the brand s enduring legacy of innovation while championing health, inclusion and active living.

Publication: Digital Terminal

ASUS ReEnters India s Tablet Market With ASUS Pad: 2.8K OLED Display & MediaTek Dimensity 8300 SoC Confirmededit

ASUS has confirmed the arrival of its new premium tablet, the ASUS Pad (T3201), in India. The upcoming tablet packs a high refresh rate OLED display, a MediaTek Dimensity chipset, a large battery with fast charging support, quad speakers, Android 16, and stylus compatibility, positioning it as a productivity and entertainment focused device.

Publication: Gizbot

Industry news

Dg matrix skeleton partner for 800v dc power in ai data centersedit

This collaboration aims to integrate fast response energy storage with solid state transformers to manage GPU power fluctuations, enhancing grid stability and operational resilience for high density AI infrastructure.

Publication: The Economic Times

From Chip to Grid to Orbit: Yotta 2026 Launches Full Agendaedit

Chipmakers, hype rscalers and cloud builders will debate what the shift from training to inference means for everything downstream. Developers and engineers will confront the race to the one-megawatt rack and the industrialization of how data centers get made.

Publication: BIS Infotech

Synopsys top executive seeks deeper India Korea semiconductor tiesedit

India and South Korea have an opportunity to deepen their semiconductor partnership by combining Korea s manufacturing and packaging capabilities with India s engineering talent, large market and chip design ambitions, Padmesh Mandloi, vice president for APAC at Synopsys who is also a board member of the Indian Chamber of Commerce in Korea told ET on Wednesday.

Publication: The Economic Times

Tata acquires land for potential OpenAI Data Centers In Indiaedit

Tata Consultancy Services (TCS) has reportedly acquired significant land parcels in southern and western India for potential data center developments, a move that could support OpenAI s OpenAI for India initiative. The company received 200 acres in Andhra Pradesh and purchased an 88acre site near Pune, Maharashtra, according to reports.

Publication: The Economic Times

Ai boom reshapes data center sustainability amidst regulatory economic pressures,edit

This shift is driven by increasing regulatory oversight, resource constraints, and the economic necessity of efficiency, especially as power availability becomes a binding constraint for new projects.

Publication: The Economic Times

AGNIT Semiconductors eyes fundraise, plans GaN chip fab under Semicon 2.0edit

Company News AGNIT Semiconductors eyes fundraise, plans GaN chip fab under Semicon 2.0 AGNIT Semiconductors, a Bengaluru startup, is planning to raise funds and may team up with partners to set up a gallium nitride (GaN) chip factory. This move is part of India s new Semicon 2.0 program, which aims to boost advanced tech manufacturing.

Publication: Communications Today

200acre semiconductor park at KWIN City near Bengaluru to become operational by December: MB Patiledit

A 200acre semiconductor park in the first phase of Karnataka s KWIN City near Bengaluru is expected to become operational by December this year, Karnataka Minister for Large and Medium Industries MB Patil said on July 23.

Publication: Money Control

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